The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Aug. 18, 2021
Applicant:

Siemens Aktiengesellschaft, Munich, DE;

Inventors:

Robert Gospos, Buckenhof, DE;

Lutz Namyslo, Hausen, DE;

Bernd Kürten, Obermichelbach, DE;

Felix Zeyss, Regensburg, DE;

Michael Endres, Schesslitz, DE;

Silvio Höhne, Forchheim, DE;

Pietro Botazzoli, Uttenreuth, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 7/00 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); H05K 5/0065 (2013.01); H05K 5/0091 (2013.01);
Abstract

A power module includes at least two power semiconductor arrangements, each having at least one semiconductor component, in contact with substrate and arranged in a housing. To improve the reliability of the power module, a first power connector and a second power connector are arranged on a first side of the housing and at least one other power connector is arranged on an opposing second side of the housing. Supply lines extending from the power connectors to the power semiconductor arrangements are arranged on the substrate in such a manner that electrical current is provided in a symmetrical manner.


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