The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Dec. 21, 2018
Applicant:
Honda Motor Co., Ltd., Tokyo, JP;
Inventors:
Kengo Aoki, Saitama, JP;
Tetsu Miyamoto, Saitama, JP;
Ayumu Uno, Tokyo, JP;
Takeshi Otani, Saitama, JP;
Daisuke Komazawa, Saitama, JP;
Assignee:
HONDA MOTOR CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/6568 (2014.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); H01M 10/48 (2006.01); H02J 7/00 (2006.01); B60L 53/302 (2019.01); B60L 58/26 (2019.01);
U.S. Cl.
CPC ...
H01M 10/6568 (2015.04); B60L 53/302 (2019.02); B60L 58/26 (2019.02); H01M 10/486 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H02J 7/00309 (2020.01);
Abstract
A temperature adjustment circuit includes a first temperature adjustment circuit and a second temperature adjustment circuit in which a switching part that is configured to switch between a circulation state where a heat-transfer medium is circulated through a connection circuit in which the first temperature adjustment circuit and the second temperature adjustment circuit are connected to each other and a non-circulation state where the heat-transfer medium is not circulated through the connection circuit.