The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Jul. 28, 2021
Applicant:

Lisa Draexlmaier Gmbh, Vilsbiburg, DE;

Inventors:

Stefan Seidl, Landshut, DE;

Alexander Hahn, Roettenbach, DE;

Assignee:

LISA DRAEXLMAIER GMBH, Vilsbiburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/04 (2006.01); H01M 10/613 (2014.01); H01M 10/653 (2014.01); H01M 10/6554 (2014.01); H01M 10/48 (2006.01); H01M 50/202 (2021.01);
U.S. Cl.
CPC ...
H01M 10/0404 (2013.01); H01M 10/48 (2013.01); H01M 10/613 (2015.04); H01M 10/653 (2015.04); H01M 10/6554 (2015.04); H01M 50/202 (2021.01);
Abstract

A method and system for thermal connection of a heat source of a battery system to a heat sink of the battery system are provided. The method includes implementing of a placing process using a placing device, wherein a distance between an electrically conducting housing surface of the heat source and an electrically conducting heat-transmission surface that is part of the heat sink or is adjacent to it, is reduced by compression of an electrically insulating heat-conducting material. The method also includes implementing of a continuous measurement of capacitance between the housing surface and the heat-transmission surface during the placing process using a measuring device. Additionally, the method includes monitoring of a layer thickness of the heat-conducting material and controlling of the placing device using a control device until a prescribed layer thickness of the heat-conducting material is attained based on the capacitance measurement.


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