The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Nov. 30, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Kotaro Kawahara, Tokyo, JP;
Shiro Hino, Tokyo, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/10 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7806 (2013.01); H01L 29/1095 (2013.01); H01L 29/1608 (2013.01);
Abstract
A technique for maintaining maximum unipolar current density while improving I2t tolerance is provided. In a semiconductor device, a first impurity layer and a Schottky interface are formed to sandwich a well layer therebetween. A first impurity layer is formed from an outermost layer of the well layer located closer to the Schottky interface than a source layer to below the source layer. The lower face of the first impurity layer is located below the Schottky interface.