The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

May. 26, 2022
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Megumi Ishiduki, Yokkaichi Mie, JP;

Hiroshi Nakaki, Yokkaichi Mie, JP;

Takamasa Ito, Nagoya Aichi, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/792 (2006.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01); H10B 43/50 (2023.01); H01L 23/528 (2006.01); H01L 21/768 (2006.01); H10B 41/20 (2023.01); H10B 43/35 (2023.01); H10B 43/40 (2023.01); H10B 43/30 (2023.01); H01L 27/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42344 (2013.01); H01L 29/66833 (2013.01); H01L 29/7926 (2013.01); H10B 43/10 (2023.02); H10B 43/27 (2023.02); H10B 43/50 (2023.02); H01L 21/76895 (2013.01); H01L 23/528 (2013.01); H01L 27/10 (2013.01); H10B 41/20 (2023.02); H10B 43/30 (2023.02); H10B 43/35 (2023.02); H10B 43/40 (2023.02);
Abstract

A semiconductor device includes a base body, a stacked body on the base body and a first columnar part. The base body includes a substrate, a first insulating film on the substrate, a first conductive film on the first insulating film, and a first semiconductor part on the first conductive film. The stacked body includes conductive layers and insulating layers stacked alternately in a stacking direction. The first columnar part is provided inside the stacked body and the first semiconductor part. The first columnar part includes a semiconductor body and a memory film between the semiconductor body and conductive layers. The semiconductor body extends in the stacking direction. The first columnar part has a first diameter and a second diameter in a first direction crossing the stacking direction. The first diameter inside the first semiconductor part is larger than the second diameter inside the stacked body.


Find Patent Forward Citations

Loading…