The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Feb. 26, 2021
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventor:
Kazuma Hasegawa, Kamakura Kanagawa, JP;
Assignee:
Kioxia Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 24/13 (2013.01); H01L 24/20 (2013.01); H01L 24/45 (2013.01); H01L 25/18 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/211 (2013.01); H01L 2224/214 (2013.01); H01L 2224/4502 (2013.01); H01L 2224/46 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1438 (2013.01);
Abstract
According to one embodiment, a semiconductor device includes a support and a stacked body on the support. The stacked body is formed of a plurality of semiconductor chips that are stacked on each other. The stacked body has a lower surface facing the support and an upper surface facing away from the support. A first wire is connected to one of the semiconductor chips in the stack and extends upward from the semiconductor chip to at least the height of the upper surface of the stacked body. A second wire is connected to the support and extends upward from the support to at least the height of the upper surface of the stacked body.