The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Aug. 08, 2022
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Ryoichi Kato, Matsumoto, JP;

Yoshinari Ikeda, Matsumoto, JP;

Yuma Murata, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/49 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01); H01R 4/02 (2006.01); H01R 43/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5222 (2013.01); H01L 23/49 (2013.01); H01L 23/49811 (2013.01); H01L 25/162 (2013.01); H01R 4/029 (2013.01); H01R 43/0221 (2013.01);
Abstract

A capacitor includes a case including a capacitor element, a first connection terminal, a second connection terminal, and a second insulating sheet formed between the first connection terminal and the second connection terminal, and the first connection terminal, the second insulating sheet, and the second connection terminal extend to the outside from the case. A semiconductor module includes a multi-layer terminal portion in which a first power terminal, a first insulating sheet, and a second power terminal are sequentially stacked. The first power terminal includes a first bonding area electrically connected to the first connection terminal, and the second power terminal includes a second bonding area electrically connected to the second connection terminal. The first insulating sheet includes a terrace portion that extends in a direction from the second bonding area towards the first bonding area in a planar view.


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