The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Sep. 03, 2020
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventors:
Daigo Suzuki, Kawasaki Kanagawa, JP;
Kosuke Awaga, Yokohama Kanagawa, JP;
Assignee:
Kioxia Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 23/433 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 5/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/433 (2013.01); H01L 25/18 (2013.01); H05K 1/0204 (2013.01); H05K 1/0271 (2013.01); H05K 1/147 (2013.01); H05K 1/189 (2013.01); H05K 5/006 (2013.01); H05K 7/20445 (2013.01); H05K 1/0215 (2013.01); H05K 1/181 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10189 (2013.01);
Abstract
A semiconductor storage device includes a housing, an interface substrate attached to the housing, an insulating substrate in the housing, a first flexible substrate connecting the insulating substrate and the interface substrate, a first integrated circuit on a first surface of the insulating substrate, and a first heat conductor arranged on a second surface of the insulating substrate that is opposite to the first surface, and contacting a first inner surface of the housing.