The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Jul. 11, 2019
Mitsubishi Electric Corporation, Tokyo, JP;
Daisuke Oya, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
It is an object to provide technology allowing for improvement in productivity of a semiconductor device. A semiconductor device includes: a base plate; an insulating substrate including a ceramic plate integrally bonded to an upper surface of the base plate with no solder layer therebetween and a circuit pattern disposed on an upper surface of the ceramic plate; a semiconductor element mounted on an upper surface of the circuit pattern; a case surrounding the insulating substrate and the semiconductor element over the base plate; an adhesive to adhere a lower portion of the case to an outer peripheral portion of the ceramic plate; and a sealant to seal the interior of the case, wherein the adhesive is in contact with an outer peripheral end of the ceramic plate to an outer peripheral end of the circuit pattern.