The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Sep. 08, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Khokan Chandra Paul, Cupertino, CA (US);

Ravikumar Patil, Karnataka, IN;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); C23C 16/458 (2006.01); C23C 16/509 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32091 (2013.01); C23C 16/4586 (2013.01); C23C 16/509 (2013.01); H01J 37/32715 (2013.01); H01L 21/67069 (2013.01); H01L 21/6833 (2013.01); H01L 21/68742 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/20235 (2013.01);
Abstract

Exemplary semiconductor substrate supports may include a pedestal having a shaft and a platen. The semiconductor substrate supports may include a cover plate. The cover plate may be coupled with the platen along a first surface of the cover plate. The cover plate may define a recessed channel in a second surface of the cover plate opposite the first surface. The semiconductor substrate supports may include a puck coupled with the second surface of the cover plate. The puck may incorporate an electrode. The puck may define a plurality of apertures extending vertically through the puck to fluidly access the recessed channel defined in the cover plate.


Find Patent Forward Citations

Loading…