The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Jun. 16, 2020
Applicants:

Lite-on Electronics (Guangzhou) Limited, Guangzhou, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Jian-Jhih Chen, Taipei, TW;

Ming-Fu Yen, Taipei, TW;

Wei-Pin Chuang, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 13/14 (2006.01); H01H 13/02 (2006.01); H01H 13/10 (2006.01); H03K 17/969 (2006.01);
U.S. Cl.
CPC ...
H01H 13/14 (2013.01); H01H 13/023 (2013.01); H01H 13/10 (2013.01); H03K 17/969 (2013.01); H01H 2219/06 (2013.01); H01H 2219/062 (2013.01);
Abstract

A key module includes a bottom plate, a circuit layer, a key cap, a supporting structure, a touch member, and a flexible circuit board. The bottom plate has a first surface and a second surface opposite to each other. The circuit layer is disposed on the first surface and has a first opening. The key cap is disposed above the circuit layer and covers the first opening. The supporting structure is disposed between the bottom plate and the key cap. The touch member is disposed at the key cap. The flexible circuit board is electrically connected to the touch member and passes through the first opening to extend next to the second surface of the bottom plate. When the key cap moves downward relative to the bottom plate, a portion of the flexible circuit board located between the key cap and the bottom plate is bent.


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