The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Feb. 17, 2021
Applicant:

Resonac Corporation, Tokyo, JP;

Inventors:

Tomoki Morijiri, Tokyo, JP;

Kengo Shinohara, Tokyo, JP;

Ayao Matsukawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); H01R 11/01 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); H01R 11/01 (2013.01);
Abstract

A connected structure including: a first circuit member having a first electrode; a second circuit member having a second electrode; and a connecting portion provided between the first circuit member and the second circuit member and electrically connecting the first electrode and the second electrode to each other, wherein at least one of the first electrode and the second electrode has a layer made of Cu or Ag as an outermost surface thereof, and the connecting portion contains a conductive particle having a layer made of Pd or Au as an outermost surface thereof.


Find Patent Forward Citations

Morijiri, Tomoki. (2024). Adhesive composition and coupling structure (U.S. Patent No. 11887748). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11887748

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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