The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Nov. 04, 2022
Sae Magnetics (H.k.) Ltd., Hong Kong, CN;
Ryo Hosoi, Hong Kong, CN;
Seiichi Takayama, Hong Kong, CN;
Kang Gao, Hong Kong, CN;
Yasuhiro Konakawa, Hong Kong, CN;
Yasutoshi Fujita, Hong Kong, CN;
Ryuji Fujii, Hong Kong, CN;
SAE MAGNETICS (H.K.) LTD., Hong Kong, CN;
Abstract
The laser diode includes an electrode pad layer, being connected to an electrode, and an outer surface in which the electrode pad layer is formed. The electrode pad layer includes a solder-bonding pad part and a solder-contact preventing part. The solder-contact preventing part is formed with small wettability material having solder wettability which is smaller than solder wettability of the solder-bonding pad part. The solder-bonding pad part and the solder-contact preventing part are formed so that a pad height, being a height from the outer surface to a surface of the solder-bonding pad part, is larger than a preventing height, being a height from the outer surface to a surface of the solder-contact preventing part.