The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
May. 13, 2022
Applicants:
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Ati Technologies Ulc, Markham, CA;
Inventors:
Assignees:
ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);
ATI TECHNOLOGIES ULO, Markham, CA;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/40 (2006.01); G06F 13/20 (2006.01); H01L 25/065 (2023.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4031 (2013.01); G06F 13/20 (2013.01); H01L 23/5382 (2013.01); H01L 25/0655 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1431 (2013.01);
Abstract
A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at the same time.
Quick Actions:
Shen, Yulei. (2024). Sharing package pins in a multi-chip module (mcm) (U.S. Patent No. 11886370). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11886370
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile