The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Sep. 14, 2023
Qualcomm Incorporated, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
Methods and apparatuses directed to more efficient data transfers within die architectures. In some examples, a die package includes controller logic electrically coupled to a first communication bus and a second communication bus. The controller logic can receive an initial data transfer request over the first communication bus, and determine a final address of the initial data transfer request. Further, the controller logic can assert a chip select signal of the second communication bus to initiate a data exchange. While asserting the chip select signal, the controller logic can receive an additional data transfer request over the first communication bus, and determine an initial address of the additional data transfer request. Based on the determined initial and final addresses, the controller logic can initiate an additional data exchange over the second communication bus without de-asserting the chip select signal.