The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Feb. 22, 2021
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Daisuke Kori, Joetsu, JP;

Takashi Sawamura, Joetsu, JP;

Keisuke Niida, Joetsu, JP;

Seiichiro Tachibana, Joetsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/11 (2006.01); C09D 7/20 (2018.01); C08F 138/00 (2006.01); C09D 4/00 (2006.01); C09D 149/00 (2006.01); G03F 7/09 (2006.01); H01L 21/027 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C08F 138/00 (2013.01); C09D 4/00 (2013.01); C09D 7/20 (2018.01); C09D 149/00 (2013.01); G03F 7/094 (2013.01); H01L 21/0273 (2013.01); H01L 21/768 (2013.01);
Abstract

A material for forming an organic film, including: a compound for forming an organic film shown by the following general formula (1A); and an organic solvent, where Wrepresents a tetravalent organic group, n1 an integer of 0 or 1, n2 an integer of 1 to 3, and Ran alkynyl group having 2 to 10 carbon atoms. A compound for forming an organic film is cured not only under air, but also under film formation conditions of inert gas, and forms an organic film having not only excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but also favorable adhesion to a substrate, and a material for forming an organic film containing the compound, and a substrate for manufacturing a semiconductor device using the material, a method for forming an organic film using the material, and a patterning process using the material.


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