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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11886115 B1

PDFFull Text
Date of Patent:
Jan. 30, 2024

Filed:

Apr. 12, 2023

Resin, positive photosensitive resin composition and use

Applicant:

Yantai Sunera Llc, Yantai, CN;

Inventors:

Zhiguo Wang, Yantai, CN;

Xuesong Jiang, Yantai, CN;

Guangqiang Shao, Yantai, CN;

Xinyu Qiu, Yantai, CN;

Hongyin Dai, Yantai, CN;

Baohua Hu, Yantai, CN;

Assignee:

YANTAI SUNERA LLC, Yantai, CN;

Attorneys:

True Shepherd LLC

Andrew C. Cheng

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/023 (2006.01); G03F 7/022 (2006.01); G03F 7/039 (2006.01); G03F 7/004 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0233 (2013.01); G03F 7/0048 (2013.01); G03F 7/022 (2013.01); G03F 7/0226 (2013.01); G03F 7/039 (2013.01);
Abstract

A positive photosensitive resin composition comprises a resin, a diazonaphthoquinone compound and a solvent. The resin comprises a combination of any one or more of polyamic acid, polyamic ester and polyimide of a segment shown in the following structure; . The resin film formed by the positive photosensitive resin composition is applied to a semiconductor passivation film, a semiconductor element protective film, an insulating layer of an organic electroluminescent element, a flat film of a thin film transistor (TFT) substrate, a wiring protective insulating film of a circuit board and a flat film for displays and solid camera elements. The photosensitive resin film formed by the positive photosensitive resin composition has the characteristics of low shrinking rate and excellent heat resistance and resolving power, and has good application effect in electronic elements.

Find Patent Forward Citations

Wang, Zhiguo. (2024). Resin, positive photosensitive resin composition and use (U.S. Patent No. 11886115). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11886115

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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