The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Feb. 04, 2020
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Koichiro Nakashima, Fukui, JP;
Takashi Uchida, Fukui, JP;
Yusuke Nakamura, Hyogo, JP;
Hideki Ueda, Fukui, JP;
Naruhito Noda, Fukui, JP;
Toshitsugu Konishi, Fukui, JP;
Toshio Yamazaki, Fukui, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01C 19/5783 (2012.01); B81B 7/00 (2006.01); G01C 19/5684 (2012.01);
U.S. Cl.
CPC ...
G01C 19/5783 (2013.01); B81B 7/007 (2013.01); B81B 7/0048 (2013.01); G01C 19/5684 (2013.01); B81B 2201/0242 (2013.01);
Abstract
A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.