The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Oct. 06, 2022
Nissan Chemical Corporation, Tokyo, JP;
Hibiki Ishijima, Funabashi, JP;
Eiichiro Ishimizu, Funabashi, JP;
NISSAN CHEMICAL CORPORATION, Tokyo, JP;
Abstract
A polishing composition used in wafer polishing process for eliminating protrusion around laser mark, thereby achieving a flat polished surface, as well as a wafer polishing method using the polishing composition. A post-polishing composition for elimination of a laser mark remaining after polishing of silicon wafer with a primary polishing composition containing silica particles, water, and a basic compound, the post-polishing composition including silica particles, water, a tetraalkylammonium ion, and a water-soluble polymer, wherein the mass ratio of the tetraalkylammonium ion to SiOof the silica particles is 0.200 to 1.000:1; the mass ratio of SiOdissolved in the polishing composition to SiOof the silica particles is 0.100 to 1.500:1; and the mass ratio of the water-soluble polymer to SiOof the silica particles is 0.005 to 0.05:1. The silica particles have an average primary particle diameter of 1 nm to 100 nm.