The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Aug. 28, 2017
Applicant:

Nissan Chemical Corporation, Tokyo, JP;

Inventors:

Yuki Endo, Toyama, JP;

Hiroaki Yaguchi, Toyama, JP;

Makoto Nakajima, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/40 (2006.01); G03F 7/004 (2006.01); G03F 7/075 (2006.01); G03F 7/11 (2006.01); C08G 77/38 (2006.01); C09D 183/04 (2006.01); C08G 77/18 (2006.01); C08G 77/00 (2006.01);
U.S. Cl.
CPC ...
C09D 183/04 (2013.01); C08G 77/18 (2013.01); C08G 77/38 (2013.01); G03F 7/0045 (2013.01); G03F 7/0752 (2013.01); G03F 7/0757 (2013.01); G03F 7/11 (2013.01); G03F 7/40 (2013.01); C08G 77/80 (2013.01);
Abstract

An acetal-protected polysiloxane composition, used as a photosensitive composition and a coating composition for forming a flat film on a substrate to be processed for performing pattern reversal. A coating composition or photosensitive composition including: a polysiloxane obtained from a hydrolysis-condensation product of a hydrolyzable silane having 2 to 4 hydrolyzable groups in a molecule by protecting the condensation product's silanol groups with acetal groups, wherein in the hydrolysis-condensation product, an organic group bonded to silicon atoms through Si—C bonds exists in molar ratio of 0≤(organic group)/(Si)≤0.29 on average. Method for producing semiconductor device, including steps: forming resist film on a semiconductor substrate; exposing resist film and developing resist after exposure to obtain resist pattern; applying the coating composition onto patterned resist film to embed the polysiloxane; curing the embedded polysiloxane and then etching resist film to reverse the pattern; and processing substrate using polysiloxane film.


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