The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Mar. 05, 2020
Applicant:
Zeon Corporation, Tokyo, JP;
Inventor:
Kouichirou Maeda, Tokyo, JP;
Assignee:
ZEON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 23/22 (2006.01); H01M 50/193 (2021.01); C09K 3/10 (2006.01); H01M 50/184 (2021.01);
U.S. Cl.
CPC ...
C08L 23/22 (2013.01); C09K 3/10 (2013.01); H01M 50/193 (2021.01); C08L 2203/20 (2013.01); C09K 2200/0607 (2013.01); C09K 2200/0617 (2013.01); H01M 50/184 (2021.01);
Abstract
A sealant for an electrochemical device contains (A) a polyisobutylene polymer and (B) a conjugated diene polymer. The sealant contains the (A) polyisobutylene polymer in a proportion of more than 60 mass % and not more than 98 mass % and the (B) conjugated diene polymer in a proportion of not less than 2 mass % and less than 40 mass % relative to the total mass of the (A) polyisobutylene polymer and the (B) conjugated diene polymer.