The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Mar. 18, 2020
Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Hiroyuki Morita, Osaka, JP;

Takeshi Wakiya, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 101/12 (2006.01); C08J 3/12 (2006.01); C08G 59/50 (2006.01); C08K 3/08 (2006.01); C08L 63/00 (2006.01); H01B 1/22 (2006.01); H01R 11/01 (2006.01);
U.S. Cl.
CPC ...
C08J 3/12 (2013.01); C08G 59/50 (2013.01); C08K 3/08 (2013.01); C08L 63/00 (2013.01); H01B 1/22 (2013.01); H01R 11/01 (2013.01); C08K 2003/0862 (2013.01);
Abstract

Provided is a resin particle that can be uniformly brought into contact with an adherend, can effectively enhance adhesion to a conductive portion and impact resistance when electrodes are electrically connected to each other using a conductive particle having the conductive portion formed on a surface thereof, and further can effectively reduce connection resistance. In the resin particle according to the present invention, an exothermic peak is observed when differential scanning calorimetry is performed by heating the resin particle at a temperature rising rate of 5° C./min from 100° C. to 350° C. in an air atmosphere.


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