The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Dec. 09, 2019
Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;
Kukdo Chemical Co., Ltd., Seoul, KR;
Masahiro Soh, Tokyo, JP;
Kazuo Ishihara, Tokyo, JP;
Jin Soo Lee, Seoul, KR;
Jae Il Kim, Seoul, KR;
Joong Hwi Jee, Seoul, KR;
Ki Hwan Yu, Seoul, KR;
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., Tokyo, JP;
KUKDO CHEMICAL CO., LTD., Seoul, KR;
Abstract
Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below. In the formula, R's each represent a hydrocarbon group having 1 to 10 carbon atoms; R's each represent a hydrogen atom, Formula (1), or Formula (1), where at least one of R's is Formula (1) or Formula (1); and n represents the number of repetitions of 0 to 5.