The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Dec. 06, 2018
Applicant:

Teijin Limited, Osaka, JP;

Inventors:

Shuhei Suzuki, Osaka, JP;

Masahiro Kitagawa, Osaka, JP;

Takeru Ohki, Osaka, JP;

Assignee:

Teijin Limited, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/34 (2006.01); B29C 43/00 (2006.01); B29C 70/34 (2006.01); B29K 101/12 (2006.01); B29K 105/08 (2006.01); B29K 105/12 (2006.01); B29K 105/26 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
B29C 43/34 (2013.01); B29C 43/003 (2013.01); B29C 70/345 (2013.01); B29C 2791/002 (2013.01); B29K 2101/12 (2013.01); B29K 2105/08 (2013.01); B29K 2105/12 (2013.01); B29K 2105/26 (2013.01); B29K 2307/04 (2013.01);
Abstract

A method for producing a press molded body is provided in which a material X that contains a thermoplastic resin Rand carbon fibers A having a weight average fiber length Land a material Y that contains a thermoplastic resin Rand carbon fibers B having a weight average fiber length Lare heated, and the heated material X and material Y are pressed within a mold at the same time, thereby producing a press molded body which has a region X that is formed of the material X and a region Y that is formed of the material Y. This method for producing a press molded body is configured such that: L<L; Lis from 0.1 mm to 15 mm (inclusive); and the press molded body has a transition zone XY where the region X and the region Y overlap with each other.


Find Patent Forward Citations

Loading…