The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
May. 13, 2021
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventors:
Takahiko Kawasaki, Nagoya Aichi, JP;
Yukiteru Matsui, Nagoya Aichi, JP;
Akifumi Gawase, Kuwana Mie, JP;
Assignee:
KIOXIA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/26 (2012.01); B24B 37/24 (2012.01); B24B 53/017 (2012.01); H01L 21/768 (2006.01); H01L 21/321 (2006.01); H01L 21/3105 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
B24B 37/26 (2013.01); B24B 37/24 (2013.01); B24B 53/017 (2013.01); H01L 21/31055 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01); H01L 21/76805 (2013.01); H01L 21/76819 (2013.01); H01L 21/76895 (2013.01); H01L 23/53257 (2013.01);
Abstract
A polishing pad is described. The polishing pad includes a surface having plural recess portions, and a substrate is polished by the surface. In the pad, an average width of the recess portions at one area of the surface in a direction parallel to the surface is 20 μm or less, and an average density of the recess portions at one area of the surface is 1,300/mmor more.