The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Sep. 07, 2022
Applicant:

Additive Technologies, Llc, Palm City, FL (US);

Inventors:

Kareem Tawil, Pittsford, NY (US);

Christopher T. Chungbin, Webster, NY (US);

Assignee:

ADDITIVE TECHNOLOGIES, LLC, Palm City, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/22 (2021.01); B22F 12/53 (2021.01); B33Y 30/00 (2015.01); B33Y 10/00 (2015.01); B22D 35/06 (2006.01); B22D 23/00 (2006.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B22D 35/06 (2013.01); B22D 23/003 (2013.01); B22F 10/22 (2021.01); B22F 12/53 (2021.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

A 3D printer includes an ejector configured to receive a build material. The 3D printer also includes a valve configured to control flow of the build material into or through the ejector. The valve includes a cooler configured to cool the build material to below a melting point of the build material to form a solid plug to prevent the build material from flowing therethrough. The valve also includes a heater configured to re-heat the build material to above the melting point to allow the build material to flow therethrough. The 3D printer also includes a nozzle positioned downstream from the valve. The build material is ejected through the nozzle. The 3D printer also includes a substrate positioned below the nozzle. The build material lands on the substrate and cools and solidifies thereon to form a 3D object.


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