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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11882762 B1

PDFFull Text
Date of Patent:
Jan. 23, 2024

Filed:

Nov. 20, 2015

Formulation and method for preparation of organic electronic devices

Applicant:

Flexenable Technology Ltd., Cambridge, GB;

Inventors:

Philip Edward May, Sidcup, GB;

Mark James, Romsey, GB;

Piotr Wierzchowiec, Southampton, GB;

Stephen Bain, Southampton, GB;

Paul Craig Brookes, Southampton, GB;

Edgar Kluge, Gross-Gerau, DE;

Li Wei Tan, Eastleigh, GB;

David Sparrowe, Bournemouth, GB;

Magda Goncalves-Miskiewicz, Southampton, GB;

Assignee:

FLEXENABLE TECHNOLOGY LIMITED, Cambridge, GB;

Attorney:

TAROLLI, SUNDHEIM, COVELL & TUMMINO L.L.P.

Primary Examiner:

Douglas J McGinty

Int. Cl.
CPC ...
H10K 85/40 (2023.01); C09K 11/06 (2006.01); H05B 33/10 (2006.01); C09B 69/10 (2006.01); H10K 10/46 (2023.01); H10K 71/15 (2023.01); H10K 85/10 (2023.01); H10K 30/00 (2023.01); H10K 50/11 (2023.01); H10K 71/13 (2023.01); H10K 85/60 (2023.01); H10K 101/10 (2023.01);
U.S. Cl.
CPC ...
H10K 85/40 (2023.02); C09B 69/101 (2013.01); C09B 69/109 (2013.01); C09K 11/06 (2013.01); H05B 33/10 (2013.01); H10K 10/484 (2023.02); H10K 71/15 (2023.02); H10K 85/115 (2023.02); C09K 2211/1037 (2013.01); C09K 2211/1416 (2013.01); C09K 2211/1425 (2013.01); C09K 2211/1441 (2013.01); C09K 2211/185 (2013.01); H10K 10/464 (2023.02); H10K 10/466 (2023.02); H10K 30/00 (2023.02); H10K 50/11 (2023.02); H10K 71/13 (2023.02); H10K 85/626 (2023.02); H10K 85/6576 (2023.02); H10K 2101/10 (2023.02); Y02E 10/549 (2013.01);
Abstract

The present invention relates to novel formulations comprising an organic semiconductor (OSC) and one or more organic solvents. The formulation comprises a viscosity at 25° C. of less than 15 mPas and the boiling point of the solvent is at most 400° C. Furthermore, the present invention describes the use of these formulations as inks for the preparation of organic electronic (OE) devices, especially organic photovoltaic (OPV) cells and OLED devices, to methods for preparing OE devices using the novel formulations, and to OE devices, OLED devices and OPV cells prepared from such methods and formulations.

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