The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Nov. 14, 2022
Applicant:

Vorbeck Materials Corp., Jessup, MD (US);

Inventors:

Dan Scheffer, Frederick, MD (US);

Kate Redmond, Baltimore, MD (US);

Trentice Bolar, Columbia, MD (US);

Assignee:

VORBECK MATERIALS CORP., Jessup, MD (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0007 (2013.01); H05K 9/0081 (2013.01);
Abstract

Embodiments of the present invention relate to electromagnetic interference (EMI) shielding structures. Rectangular EMI shielding panels are formed that include a first and second ends. A pair of rectangular EMI shielding panels are affixed orthogonal to each other at their first ends. The pair of rectangular EMI shielding panels are successively overlapped with each other to thereby form a plurality of interconnected EMI shielding planes. The pair of rectangular EMI shielding panels are affixed to each other at their second ends to form a helical EMI shielding structure that unfolds to an unfolded state and folds to a folded state along its center axis. Here, the plurality of interconnected EMI shielding planes are each angularly offset from each other about the center axis to form a helical structure when in the unfolded state. The EMI shielding panels include an encapsulating layer and/or metallic layer.


Find Patent Forward Citations

Loading…