The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Oct. 20, 2021
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Thomas Sprafke, Huntsville, UT (US);

Stephen Marinsek, Albuquerque, NM (US);

Assignee:

Raytheon Company, Tewksbury, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/32 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H05K 3/32 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10378 (2013.01);
Abstract

A chip substrate includes a base substrate having a plurality of base circuit traces mounted thereon for supporting a chip assembly and an intermediate substrate mounted on the base substrate adjacent the plurality of base circuit traces. The intermediate substrate has a plurality of intermediate circuit traces mounted thereon. Each of the plurality of intermediate circuit traces are wirebonded to a respective one of the plurality of base circuit traces and the plurality of intermediate circuit traces are configured to be electrically coupled to an external device. For example, each of the plurality of intermediate circuit traces may be wirebonded to a respective one of a plurality of feedthrough circuit traces mounted on a feedthrough device.


Find Patent Forward Citations

Loading…