The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Mar. 30, 2020
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventor:

Makoto Yamamoto, Kirishima, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 5/00 (2006.01); H05K 5/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/092 (2013.01); H05K 1/0306 (2013.01); H05K 1/117 (2013.01); H05K 1/144 (2013.01); H05K 5/0004 (2013.01); H05K 5/04 (2013.01);
Abstract

Disclosed is a wiring board, including: an insulating substrate containing aluminum oxide; and a metallized layer that includes a metal phase containing a metal material and a first glass phase containing a glass component and that is disposed on the insulating substrate. At least one of the insulating substrate and the metallized layer further contains mullite. In the metallized layer, the metal phase continues in a three-dimensional network shape, and the first glass phase is embedded between the metal phase.


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Yamamoto, Makoto. (2024). Wiring board, electronic device package, and electronic device (U.S. Patent No. 11882654). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11882654

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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