The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Sep. 19, 2019
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Jaehyung Kim, Gyeonggi-do, KR;

Hakjin Kim, Gyeonggi-do, KR;

Minseok Park, Gyeonggi-do, KR;

Hanbin Lee, Gyeonggi-do, KR;

Sangmin Han, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H04M 1/02 (2006.01); H01Q 1/24 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01Q 1/243 (2013.01); H04M 1/0266 (2013.01);
Abstract

Disclosed is an electronic device including a housing including a front plate, a back plate facing in an opposite direction of the front plate, and a rear structure surrounding a space between the front plate and the back plate and including at least one opening, a display viewable through at least part of the front plate of the electronic device, a supporting member interposed between the display and the rear structure, at least one component interposed between the supporting member and the rear structure and at least partially overlapping with the opening when viewed from above the back plate, an antenna structure interposed between the supporting member and the rear structure, and a wireless communication circuit electrically connected to at least one of the first conductive pattern and/or the second conductive pattern and transmitting and/or receiving a signal having a specified frequency. The antenna structure includes a connection part at least partially overlapping with the opening, interposed between the component and the back plate, and including a first conductive pattern when viewed from above the back plate and a first portion connected to the connection part and including a second conductive pattern electrically connected to the first conductive pattern. Besides, various embodiments as understood from the specification are also possible.


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