The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Aug. 13, 2021
Applicants:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Amotech Co., Ltd., Incheon, KR;

Inventors:

Seunghoon Kang, Suwon-si, KR;

Jinhyoung Lee, Incheon, KR;

Kyungha Koo, Suwon-si, KR;

Jinmyoung Kim, Incheon, KR;

Hongki Moon, Suwon-si, KR;

Yoonsun Park, Suwon-si, KR;

Seyoung Jang, Suwon-si, KR;

Seungjae Hwang, Incheon, KR;

Assignees:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Amotech Co., Ltd., Incheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/02 (2006.01); H01Q 1/24 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/02 (2013.01); H01Q 1/24 (2013.01);
Abstract

An electronic device according to various embodiments of the present disclosure can comprise: a front plate facing a first direction; a rear plate facing a second direction, which is opposite to the first direction; at least one antenna module arranged between the front plate and the rear plate; and at least one heat dissipation sheet spaced from the at least one antenna module so as to be arranged to come in contact with the rear plate. The at least one heat dissipation sheet can comprise a ceramic filler and a binder resin mixed with the ceramic filler.


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