logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11881552 B1

PDFFull Text
Date of Patent:
Jan. 23, 2024

Filed:

May. 28, 2020

Cell to heat sink thermal adhesive

Applicant:

Cps Technology Holdings Llc, New York, NY (US);

Inventors:

Matthew R. Tyler, New York, NY (US);

Xugang Zhang, Shorewood, WI (US);

Assignee:

CPS Technology Holdings LLC, New York, NY (US);

Attorney:

Boardman & Clark LLP

Primary Examiner:

Gregg Cantelmo

Assistant Examiner:

Heng M Chan

Int. Cl.
CPC ...
H01M 10/0525 (2010.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); H01M 10/653 (2014.01); H01M 10/6551 (2014.01); H01M 10/6554 (2014.01); H01M 10/04 (2006.01); C09J 163/00 (2006.01); H01M 10/058 (2010.01); H01M 10/6555 (2014.01); H01M 50/24 (2021.01); H01M 50/267 (2021.01); H01M 50/55 (2021.01); H01M 50/553 (2021.01); H01M 10/658 (2014.01); H01M 50/209 (2021.01); H01M 50/264 (2021.01); H01M 10/647 (2014.01); H01M 50/507 (2021.01); H01M 50/516 (2021.01);
U.S. Cl.
CPC ...
H01M 10/0525 (2013.01); C09J 163/00 (2013.01); H01M 10/0413 (2013.01); H01M 10/058 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H01M 10/653 (2015.04); H01M 10/658 (2015.04); H01M 10/6551 (2015.04); H01M 10/6554 (2015.04); H01M 10/6555 (2015.04); H01M 50/209 (2021.01); H01M 50/24 (2021.01); H01M 50/264 (2021.01); H01M 50/267 (2021.01); H01M 50/55 (2021.01); H01M 50/553 (2021.01); H01M 10/647 (2015.04); H01M 50/507 (2021.01); H01M 50/516 (2021.01); H01M 2220/20 (2013.01);
Abstract

A battery module includes a housing having an opening and an electrochemical cell disposed in the housing. The electrochemical cell includes a first cell surface having electrode terminals and an second cell surface substantially opposite the first cell surface. The battery module also includes a heat sink integral with the housing and a thermally conductive adhesive bonded to the second cell surface and a heat sink surface that is facing the second cell surface. The thermally conductive adhesive can include a bonding shear strength and bonding tensile strength between the electrochemical cell and the heat sink of between approximately 5 megaPascals (MPa) and 50 MPa.

Find Patent Forward Citations

Loading…