The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Nov. 24, 2020
Applicant:

Songshan Lake Materials Laboratory, Dongguan, CN;

Inventors:

Weiyun Wang, Guangdong, CN;

Xinqiang Wang, Guangdong, CN;

Yongde Li, Guangdong, CN;

Houjin Wang, Guangdong, CN;

Junjie Kang, Guangdong, CN;

Ye Yuan, Guangdong, CN;

Wei Luo, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/64 (2013.01); H01L 2933/0033 (2013.01);
Abstract

An electronic device, a semiconductor device, a packaging structure, a bracket and a method for manufacturing the bracket, belonging to the field of semiconductor device packaging. The bracket includes a first frame and a second frame placed opposite to each other and connected through an electroplating layer. In the above, the first frame and the second frame are both ceramic-based and formed with a metal layer on a surface. The bracket has a longer service life.


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