The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Dec. 27, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Kohei Miki, Tokyo, JP;

Shinichi Miyakuni, Tokyo, JP;

Kohei Nishiguchi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/45 (2006.01); H01L 23/48 (2006.01); H01L 21/8252 (2006.01); H01L 27/07 (2006.01); H01L 21/768 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/454 (2013.01); H01L 23/481 (2013.01); H01L 28/60 (2013.01);
Abstract

Provided herein is: a SiC substrate having a front surface on which a GaN layer is stacked; a source electrode formed on a front surface of the GaN layer; a MIM capacitor formed on a front surface of the source electrode; and a via hole extending from a rear surface of the SiC substrate to reach the source electrode; wherein a barrier metal layer is included in the source electrode, and wherein the depth end of the via hole is placed between a rear surface of the source electrode and a rear surface of the barrier metal layer. Accordingly, intrusion of a halogen element, in particular, Br, into an insulating film that is placed in the MIM capacitor, is suppressed over a long term.


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