The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Feb. 22, 2019
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Sunil Kapoor, Vancouver, WA (US);

Thomas Frederick, West Linn, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/455 (2006.01); C23C 16/505 (2006.01); C23C 16/52 (2006.01); G01R 13/02 (2006.01); G01R 19/00 (2006.01); G01R 27/26 (2006.01); H01L 21/67 (2006.01); G01N 21/95 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32155 (2013.01); C23C 16/45536 (2013.01); C23C 16/505 (2013.01); C23C 16/52 (2013.01); G01N 21/9501 (2013.01); G01R 13/02 (2013.01); G01R 19/0084 (2013.01); G01R 27/2605 (2013.01); H01J 37/32091 (2013.01); H01J 37/3299 (2013.01); H01J 37/32183 (2013.01); H01J 37/32899 (2013.01); H01L 21/67253 (2013.01); H01L 23/642 (2013.01); H01J 2237/327 (2013.01); H01L 21/67028 (2013.01); H01L 21/67069 (2013.01); H01L 2223/6655 (2013.01);
Abstract

A method and an apparatus of plasma-assisted semiconductor processing is provided. The method comprises: a) providing substrates at each of the multiple stations; b) distributing RF power including a first target frequency to multiple stations to thereby generate a plasma in the stations, wherein the RF power is distributed according to a RF power parameter configured to reduce station to station variations; c) tuning an impedance matching circuit for a first station included in the multiple stations while distributing RF power to the first station by: i) measuring a capacitance of a capacitor in the impedance matching circuit without disconnecting the capacitor from the impedance matching circuit; and ii) adjusting, according to the capacitance measured in (i) and the RF power parameter, a capacitance of the capacitor; and d) performing a semiconductor processing operation on the substrate at each station.


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