The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Aug. 28, 2019
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Kwang Il Park, Suwon-si, KR;

Jong Min Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/292 (2013.01); H05K 9/0083 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A coil electronic component includes a support substrate having a first surface and a second surface opposing each other, a coil pattern disposed on the first surface of the support substrate, first and second conductive vias penetrating the support substrate and connected to one end and the other end of the coil pattern, respectively, an encapsulant encapsulating the support substrate and the coil pattern, and first and second external electrodes disposed on a lower surface of the encapsulant and electrically connected to the first and second conductive vias, respectively. The support substrate is disposed between the lower surface of the encapsulant and the coil pattern.


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