Three-dimensional semiconductor module including system in a package (sip) with improved heat dissipation efficiency

Abstract

The present invention provides a semiconductor module, a semiconductor member, and a method for manufacturing the same that make it possible to improve heat dissipation efficiency. This semiconductor modulecomprises: a power supply unit; a RAM unit, which is a RAM module having a facing surface disposed so as to face an exposed surface of a logic chipand an exposed surface of the power supply unit, the RAM module being disposed across some of a plurality of logic chip signal terminalsand some of a plurality of power supply unit power supply terminals; and a support substratehaving a power feeding circuit capable of feeding electrical power to the logic chip and to the power supply unit, one main surface of the support substratebeing disposed adjacent to a heat dissipation surface of the RAM unit, which is the surface of the RAM unitopposite the facing surface. The support substrateis electrically connected, using the power feeding circuit, to at least some of logic chip power supply terminalsand the other power supply unit power supply terminals. The support substratehas, at positions overlapping the RAM unit, heat dissipation viasthat penetrate in the thickness direction and come into contact with the heat dissipation surface of the RAM unit