The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Jan. 23, 2020
Applicant:

Asetek Danmark A/s, Aalborg Øst, DK;

Inventor:
Assignee:

Asetek Danmark A/S, Aalborg Øst, DK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); G05B 2219/49216 (2013.01);
Abstract

With increased demand for compact computing and easy to install computer components, there is an increased demand for user-friendly cooling solutions. Therefore, there is provided a cooling unit () for cooling liquid in a liquid-cooled computer system (), wherein the cooling unit () comprises: an airflow unit () for generating an airflow in a first direction () along an airflow path, a radiator unit () having a liquid inlet () for receiving an inflow of a cooling liquid, a liquid outlet () for releasing an outflow of cooling liquid, an inner liquid path () for conducting liquid between said liquid inlet () and said liquid outlet (), an array of at least two radiator bridges (), each having a plurality of parallel channels (), said radiator bridges () traversing said airflow path and being spaced apart along said first direction (), said radiator bridges () further being thermally separated from one another by gaps (), where a first radiator bridge () from among said array of at least two radiator bridges () is arranged to receive liquid from said liquid inlet () to pass through its channels (), said first radiator bridge () being the radiator bridge that is the farthest from said airflow unit (), where said inner liquid path () is conducted from said liquid inlet (), sequentially via said radiator bridges () by order of proximity to said first radiator bridge (), and to said liquid outlet (), whereby a flow of air generated by said airflow unit () passes through said radiator bridges () to exchange heat between said flow of air and said radiator unit (). Thereby, a cooling unit is provided that provides efficient cooling while fitting into hitherto inconvenient form factors.


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