The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2024
Filed:
Oct. 28, 2021
Texas Instruments Incorporated, Dallas, TX (US);
Enis Tuncer, Dallas, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
An electronic device includes a substrate, a dielectric spacer, a semiconductor die, and a package structure. The substrate has a dielectric layer, a die pad, first and second leads, a conductive via, and a conductive trace, the dielectric layer has an opening extending into a side, the die pad is coupled to the first lead, the second lead is coupled to the conductive via, and the conductive trace is coupled to the via. The dielectric spacer is mounted above the die pad in the opening, and the semiconductor die is mounted above the dielectric spacer, the semiconductor die includes a temperature sensor, and an electrical connection couples the semiconductor die to the conductive trace. The package structure extends on the side of the dielectric layer, on the semiconductor die, and on the conductive trace, the package structure extending around the dielectric spacer and to the die pad in the opening.