The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2024
Filed:
Sep. 26, 2022
Applicant:
Hojin Platech Co., Ltd., Ansan-si, KR;
Inventors:
Assignee:
HOJIN PLATECH CO., LTD., Ansan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/32 (2006.01); C25D 3/60 (2006.01);
U.S. Cl.
CPC ...
C25D 3/32 (2013.01); C25D 3/60 (2013.01);
Abstract
Provided is an electroplating solution of tin or a tin alloy in which the thickness variation of wafer bumps is maintained at a low level even in various changes of plating conditions and thus the mass productivity is improved. The electroplating solution of tin or a tin alloy may include tin ions as metal ions, a conductive salt, a carboxylic acid as a structure refiner, and a combination of a flavone compound and a quaternary ammonium compound as a thickness variation improving agent.