The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Oct. 03, 2019
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Adrian T. Jung, Kaarst, DE;

Boris Tasch, Düsseldorf, DE;

Dirk Hasenberg, Raeren, BE;

Olaf Ludewig, Düsseldorf, DE;

Elisabeth Cura, Düsseldorf, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 5/06 (2006.01); C08G 59/50 (2006.01); C08G 65/20 (2006.01); C08G 65/333 (2006.01); C08K 5/00 (2006.01); C09J 9/00 (2006.01);
U.S. Cl.
CPC ...
C09J 5/06 (2013.01); C08G 59/50 (2013.01); C08G 65/20 (2013.01); C08G 65/33317 (2013.01); C08K 5/0025 (2013.01); C09J 9/00 (2013.01);
Abstract

The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a cationically self-polymerizable monomer; b) a polymerization initiator of the cationically self-polymerizable monomer which is initiated at a temperature T1; c) a curable monomer which is different from the cationically self-polymerizable monomer; and d) a curing initiator of the curable monomer which is initiated at a temperature T2 and which is different from the polymerization initiator of the cationically self-polymerizable monomer. According to another aspect, the present disclosure is directed to a partially cured precursor of a structural adhesive composition. According to still another aspect, the present disclosure relates to a method of bonding to parts. In yet another aspect, the disclosure relates to the use of a curable precursor or a partially cured precursor as described above, for industrial applications, in particular for body-in-white bonding applications for the automotive industry.


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