The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2024
Filed:
Mar. 23, 2020
Applicant:
Nippon Steel Corporation, Tokyo, JP;
Inventors:
Assignee:
NIPPON STEEL CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); C22C 18/00 (2006.01); C23C 28/00 (2006.01); B21D 22/20 (2006.01); C25D 5/36 (2006.01); C23C 2/06 (2006.01); C23C 30/00 (2006.01); B21D 22/02 (2006.01); B32B 15/18 (2006.01); B32B 15/04 (2006.01); C23C 28/02 (2006.01); C23C 2/30 (2006.01); C23C 2/28 (2006.01); C23C 2/04 (2006.01); C23C 2/26 (2006.01);
U.S. Cl.
CPC ...
B32B 15/013 (2013.01); B21D 22/022 (2013.01); B21D 22/20 (2013.01); B32B 15/011 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); C22C 18/00 (2013.01); C23C 2/04 (2013.01); C23C 2/06 (2013.01); C23C 2/26 (2013.01); C23C 2/285 (2013.01); C23C 2/30 (2013.01); C23C 28/023 (2013.01); C23C 28/025 (2013.01); C23C 28/321 (2013.01); C23C 28/3225 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C25D 5/36 (2013.01); Y10T 428/12799 (2015.01); Y10T 428/12958 (2015.01); Y10T 428/12972 (2015.01);
Abstract
A hot stamped component, includes: a base material; and a Zn-based plating layer provided in contact with the base material as an upper layer of the base material and containing Zn and Ni. A region of the Zn-based plating layer on a base material side is a Fe—Zn solid solution containing Ni, and two or more twins exist in 10 crystal grains of the Fe—Zn solid solution containing Ni adjacent to an interface between the base material and the Zn-based plating layer.