The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Oct. 12, 2022
Applicant:

Ford Global Technologies, Llc, Dearborn, MI (US);

Inventors:

Alan George Dry, Grosse Pointe Woods, MI (US);

David A. Brown, Plymouth, MI (US);

Robert William Miller, Inkster, MI (US);

Assignee:

Ford Global Technologies, LLC, Dearborn, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/04 (2006.01); B23P 21/00 (2006.01); B23K 20/10 (2006.01); B29C 65/72 (2006.01); B25J 11/00 (2006.01); B29C 65/78 (2006.01); B29C 65/08 (2006.01); B29C 65/00 (2006.01); B29C 65/52 (2006.01); B25J 15/00 (2006.01); B29C 65/60 (2006.01); B29C 65/54 (2006.01); B29C 65/64 (2006.01); B23K 37/04 (2006.01); B23K 33/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/72 (2013.01); B23K 20/10 (2013.01); B23P 19/04 (2013.01); B23P 21/002 (2013.01); B25J 11/005 (2013.01); B25J 15/008 (2013.01); B29C 65/08 (2013.01); B29C 65/52 (2013.01); B29C 65/7858 (2013.01); B29C 66/742 (2013.01); B23K 33/008 (2013.01); B23K 37/0461 (2013.01); B23P 21/004 (2013.01); B23P 21/006 (2013.01); B23P 2700/50 (2013.01); B29C 65/542 (2013.01); B29C 65/606 (2013.01); B29C 65/645 (2013.01); Y10T 29/4997 (2015.01); Y10T 29/49829 (2015.01); Y10T 29/49831 (2015.01); Y10T 29/49895 (2015.01); Y10T 29/49901 (2015.01); Y10T 29/49904 (2015.01); Y10T 29/49968 (2015.01); Y10T 29/5337 (2015.01); Y10T 29/53417 (2015.01); Y10T 29/53435 (2015.01);
Abstract

A system and method for assembling a plurality of components into an assembly is provided. The system includes an assembling robot and an adhesive dispensing robot. The assembling robot is configured to attach a first sub-assembly to a second sub-assembly. The first sub-assembly includes at least one of the plurality of components, and the second sub-assembly includes remaining ones of the plurality of components. The adhesive dispensing robot is configured to apply an adhesive between the first sub-assembly and the second sub-assembly, after the first sub-assembly is attached to the second sub-assembly, to bond the first sub-assembly to the second sub-assembly.


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