The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Apr. 01, 2019
Applicant:

Toyo Kohan Co., Ltd, Tokyo, JP;

Inventors:

Takafumi Hatakeda, Yamaguchi, JP;

Yusuke Hashimoto, Yamaguchi, JP;

Teppei Kurokawa, Yamaguchi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 20/04 (2006.01); B21B 1/22 (2006.01); B23K 103/10 (2006.01); B32B 15/01 (2006.01);
U.S. Cl.
CPC ...
B23K 20/04 (2013.01); B21B 1/22 (2013.01); B21B 2001/221 (2013.01); B23K 2103/10 (2018.08); B32B 15/015 (2013.01);
Abstract

It is an object of the present invention to provide a roll-bonded laminate controlled in warping and a method for producing the same. The method produces the roll-bonded laminate having a two-layer structure of a first metal layer and a second metal layer, by roll-bonding a first metal plate and a second metal plate, wherein the surface hardness Hv of the first metal plate is lower than the surface hardness Hv of the second metal plate; and the method comprises roll-bonding so as to satisfy the following expression (1):0<(Δ)/≤38  (1)wherein ΔL(mm) represents an elongation amount of the first metal layer with respect to the first metal plate; ΔL(mm) represents an elongation amount of the second metal layer with respect to the second metal plate; and T (mm) represents the total thickness of the roll-bonded laminate.


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