The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2024
Filed:
Mar. 25, 2022
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Shunsuke Uchizono, Shiojiri, JP;
Setsuya Iwashita, Nirasaki, JP;
Yasutoshi Hideshima, Matsumoto, JP;
Fumiya Maeda, Azumino, JP;
Koichi Ozaki, Okayama, JP;
Tadao Fukuta, Kurashiki, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/16 (2022.01); B22F 1/14 (2022.01); B22F 1/102 (2022.01); B22F 3/22 (2006.01); C22C 23/00 (2006.01); C22C 1/10 (2023.01); B22F 1/05 (2022.01); C22C 32/00 (2006.01); B22D 17/00 (2006.01); C22C 1/04 (2023.01); C22C 1/051 (2023.01); C22C 1/05 (2023.01); B22F 8/00 (2006.01); B22F 3/00 (2021.01);
U.S. Cl.
CPC ...
B22F 1/16 (2022.01); B22D 17/007 (2013.01); B22F 1/05 (2022.01); B22F 1/102 (2022.01); B22F 1/14 (2022.01); B22F 3/225 (2013.01); C22C 1/0408 (2013.01); C22C 1/051 (2013.01); C22C 1/1084 (2013.01); C22C 23/00 (2013.01); C22C 32/00 (2013.01); C22C 32/0063 (2013.01); B22F 3/003 (2013.01); B22F 8/00 (2013.01); B22F 2301/058 (2013.01); B22F 2302/105 (2013.01); B22F 2998/10 (2013.01); C22C 1/05 (2013.01); Y10T 428/12181 (2015.01); Y10T 428/12556 (2015.01); Y10T 428/12576 (2015.01); Y10T 428/12729 (2015.01); Y10T 428/2438 (2015.01); Y10T 428/24405 (2015.01); Y10T 428/24413 (2015.01); Y10T 428/24421 (2015.01); Y10T 428/29 (2015.01); Y10T 428/2982 (2015.01); Y10T 428/2991 (2015.01); Y10T 428/2993 (2015.01); Y10T 428/2998 (2015.01);
Abstract
A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.