Implantable medical device with two or more encapsulated components

Abstract

Implants must protect against implant contamination and corrosion of electronics. However, when electrical components are fitted to flexible substrates, failure can occur at electrical connections. An implant comprises: a flexible substrate; a first and second electrical component at a first and second position, electrically connected through an interconnect layer; a first and second component cover, separately encapsulating the first and second component to resist the ingress of body fluids into the component positions; wherein the flexible substrate allows a relative change in disposition between the first component cover and the second component cover. One or more electrodes are provided at a third position. By encapsulating each component separately, the position of force/tension is moved away from the component attachment position to a point somewhere between the component positions. By disposing one or more electrode away from the components, the ingress is further restricted.