The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Oct. 14, 2021
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Christo Bojkov, Plano, TX (US);

Michael Roberg, Evergreen, CO (US);

Matthew Essar, Wylie, TX (US);

Walid Meliane, Frisco, TX (US);

Terry Hon, Plano, TX (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 35/24 (2006.01); H01L 51/00 (2006.01); H10K 85/10 (2023.01); H01L 23/00 (2006.01); H10K 71/10 (2023.01);
U.S. Cl.
CPC ...
H10K 85/115 (2023.02); H01L 24/03 (2013.01); H01L 24/48 (2013.01); H10K 71/10 (2023.02); H01L 2224/43827 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/73265 (2013.01);
Abstract

Semiconductor devices, and more particularly arrangements of fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices are disclosed. Arrangements include conformal coatings or layers of fluorinated polymers that cover a semiconductor die on a package substrate of a semiconductor device. Such fluorinated polymer arrangements may also conformally coat various electrical connections for the semiconductor die, including wire bonds. Fluorinated polymers with low dielectric constants and low moisture permeability may thereby provide reduced moisture ingress in semiconductor devices while also reducing the impact of associated dielectric loss.


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