The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Oct. 27, 2021
Applicant:

Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan, CN;

Inventors:

Wenxu Xianyu, Wuhan, CN;

Wenliang Gong, Wuhan, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/38 (2023.01); G06F 3/041 (2006.01); H10K 50/844 (2023.01); H10K 50/86 (2023.01); H10K 59/40 (2023.01); H10K 59/122 (2023.01); H10K 59/12 (2023.01); H10K 77/10 (2023.01);
U.S. Cl.
CPC ...
H10K 59/38 (2023.02); G06F 3/0412 (2013.01); H10K 50/844 (2023.02); H10K 50/865 (2023.02); H10K 59/122 (2023.02); H10K 59/40 (2023.02); H10K 59/1201 (2023.02); H10K 77/111 (2023.02);
Abstract

An OLED display device includes a substrate, a pixel defining layer disposed on the substrate and provided with first openings, a black bank layer disposed on the pixel defining layer and provided with second openings corresponding to the first openings, a first thin film encapsulation sublayer, and color resist layers. A width of the second openings is greater than a width of the first openings. Each part of the pixel defining layer adjacent to the first openings and each corresponding part of the black bank layer adjacent to the second openings form a stepped structure. The first thin film encapsulation sublayer covers the black bank layer, the pixel defining layer, and the substrate. Parts of the first thin film encapsulation sublayer corresponding to the stepped structures have a stepped shape. The color resist layers are disposed on parts of the first thin film encapsulation sublayer in the first openings.


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