The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Mar. 22, 2021
Applicant:

Averatek Corporation, Santa Clara, CA (US);

Inventor:

Shinichi Iketani, Sunnyvale, CA (US);

Assignee:

Averatek Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 3/06 (2006.01); H05K 3/00 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4652 (2013.01); H05K 3/0041 (2013.01); H05K 3/062 (2013.01); H05K 3/185 (2013.01); H05K 2201/0358 (2013.01); H05K 2203/0323 (2013.01); H05K 2203/0376 (2013.01); H05K 2203/0582 (2013.01); H05K 2203/06 (2013.01);
Abstract

Systems, methods, and devices related to catalyzed metal foils are disclosed. Contemplated metal foils have a bottom surface, preferably roughened to Ra of at least 0.1 μm, bearing a catalyst material. The metal foils are etchable, typically of aluminum or derivative thereof, and is less than 500 μm thick. Methods and systems for forming circuits from catalyzed metal foils are also disclosed. The catalyst material bearing surface of the metal foil is applied to a substrate and laminated, in some embodiments with a thermoset resin or thermoplastic resin therebetween or an organic material first coating the catalytic material. The metal foil is removed to expose the catalyst material, and a conductor is plated to the catalyst material.


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